The JEDEC Solid State Technology Association initially planned to release a final specification for the next generation mainstream memory standard, DDR5 SDRAM, in 2018, but the new specification was officially announced today after a jump of about two years. Following the release of the new memory specification, major memory manufacturers are also taking place. The memory products based on the new specification should be available for mass production as soon as this year, and are expected to be used first in the server market and then in consumer PCS and other devices.

According to the new memory standard released by JEDEC, the main improvements in DDR5 memory are in memory density and frequency. Under the new standard, the maximum memory speed will be 6.4Gbps, the capacity of a single LRDIMM will be up to 2TB, and the maximum UDIMM capacity will be 128 GB.

LRDIMM (Load-Reduced DIMM) refers to the use of new technologies and lower operating voltages to reduce the Load and power consumption of the server memory bus, and allow the server memory bus to operate at higher frequencies and significantly increase memory support capacity. UDIMM is Unbuffered Dual -Line Memory Modules or Unregistered Dual -Line Memory Modules.

In terms of capacity and density, the density of a single memory chip in DDR5 can reach 64Gbit, which is four times higher than the 16Gbit of DDR4. In terms of memory bandwidth, the DDR5 will double the current DDR4 memory and is expected to reach 4.8Gbps, while the total transmission bandwidth will increase by 38%, up to around 8400MHz.

News reprinted from：expreview.com